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Commission on Engineering and Technical Systems & Committee on Materials for High-Density Electronic Packaging
Materials for High-Density Electronic Packaging and Interconnection [PDF ebook]

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Обкладинка Commission on Engineering and Technical Systems & Committee on Materials for High-Density Electronic Packaging: Materials for High-Density Electronic Packaging and Interconnection (PDF)

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Мова Англійська ● Формат PDF ● Сторінки 156 ● ISBN 9780309536691 ● Видавець National Academies Press ● Опубліковано 1990 ● Завантажувані 3 разів ● Валюта EUR ● Посвідчення особи 7146652 ● Захист від копіювання Adobe DRM

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Commission on Engineering and Technical Systems Committee on Materials for High-Density Electronic Packaging Division on Engineering and Physical Sciences National Materials Advisory Board National Research Council

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