Materials for High-Density Electronic Packaging and Interconnection

Commission on Engineering and Technical Systems & Committee on Materials for High-Density Electronic Packaging

Commission on Engineering and Technical Systems & Committee on Materials for High-Density Electronic Packaging
Materials for High-Density Electronic Packaging and Interconnection [PDF ebook]

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的封面 Commission on Engineering and Technical Systems & Committee on Materials for High-Density Electronic Packaging: Materials for High-Density Electronic Packaging and Interconnection (PDF)

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语言英语 ● 格式 PDF ● 网页 156 ● ISBN 9780309536691 ● 出版者 National Academies Press ● 发布时间 1990 ● 下载 3 时 ● 货币 EUR ● ID 7146652 ● 复制保护 Adobe DRM

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Commission on Engineering and Technical Systems Committee on Materials for High-Density Electronic Packaging Division on Engineering and Physical Sciences National Materials Advisory Board National Research Council

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