Tae-Kyu Lee & Thomas R. Bieler: Fundamentals of Lead-Free Solder Interconnect Technology (PDF) < إلكترونيات , هندسة كهربائية < الهندسة / التقنيات < علوم < آخر الأخبار

Tae-Kyu Lee & Thomas R. Bieler
Fundamentals of Lead-Free Solder Interconnect Technology [PDF ebook]
From Microstructures to Reliability

الدعم

غلاف Tae-Kyu Lee & Thomas R. Bieler: Fundamentals of Lead-Free Solder Interconnect Technology (PDF)

This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.

€96.29

قائمة المحتويات

Introduction.- Interconnection : The Joint.- Phase Equilibria and Microstructure of Sn-Ag-Cu Alloys.- Microstructure Development; Solidification and Isothermal Aging.- Thermal Cycling Performance.- Mechanical Stability and Performance.- Chemical and Environment Attack.- Challenges in Future Generation Interconnects: Microstructure Again.

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لغة الإنجليزية ● شكل PDF ● صفحات 253 ● ISBN 9781461492665 ● حجم الملف 16.1 MB ● الناشر Springer US ● مدينة NY ● بلد US ● نشرت 2014 ● للتحميل 24 الشهور ● دقة EUR ● هوية شخصية 3534153 ● حماية النسخ DRM الاجتماعية

المزيد من الكتب الإلكترونية من نفس المؤلف (المؤلفين) / محرر

Tae-Kyu Lee Thomas R. Bieler Choong-Un Kim Hongtao Ma

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