Catalog > Science > Technique > Electronique, Electrotechnique, Télécommunications > Tae-Kyu Lee & Thomas R. Bieler: Fundamentals of Lead-Free Solder Interconnect Technology (PDF)

Tae-Kyu Lee & Thomas R. Bieler
Fundamentals of Lead-Free Solder Interconnect Technology [PDF ebook]
From Microstructures to Reliability

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Couverture du Tae-Kyu Lee & Thomas R. Bieler: Fundamentals of Lead-Free Solder Interconnect Technology (PDF)

This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.

€96.29

Table des matières

Introduction.- Interconnection : The Joint.- Phase Equilibria and Microstructure of Sn-Ag-Cu Alloys.- Microstructure Development; Solidification and Isothermal Aging.- Thermal Cycling Performance.- Mechanical Stability and Performance.- Chemical and Environment Attack.- Challenges in Future Generation Interconnects: Microstructure Again.

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Langue Anglais ● Format PDF ● Pages 253 ● ISBN 9781461492665 ● Taille du fichier 16.1 MB ● Maison d’édition Springer US ● Lieu NY ● Pays US ● Publié 2014 ● Téléchargeable 24 mois ● Devise EUR ● ID 3534153 ● Protection contre la copie DRM sociale

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