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Tae-Kyu Lee & Thomas R. Bieler
Fundamentals of Lead-Free Solder Interconnect Technology [PDF ebook]
From Microstructures to Reliability

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perlindungan daripada Tae-Kyu Lee & Thomas R. Bieler: Fundamentals of Lead-Free Solder Interconnect Technology (PDF)

This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.

€96.29

Jadual kandungan

Introduction.- Interconnection : The Joint.- Phase Equilibria and Microstructure of Sn-Ag-Cu Alloys.- Microstructure Development; Solidification and Isothermal Aging.- Thermal Cycling Performance.- Mechanical Stability and Performance.- Chemical and Environment Attack.- Challenges in Future Generation Interconnects: Microstructure Again.

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Bahasa Inggeris ● Format PDF ● Halaman-halaman 253 ● ISBN 9781461492665 ● Saiz fail 16.1 MB ● Penerbit Springer US ● Bandar raya NY ● Negara US ● Diterbitkan 2014 ● Muat turun 24 bulan ● Mata wang EUR ● ID 3534153 ● Salin perlindungan Social DRM

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Tae-Kyu Lee Thomas R. Bieler Choong-Un Kim Hongtao Ma

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