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Tae-Kyu Lee & Thomas R. Bieler
Fundamentals of Lead-Free Solder Interconnect Technology [PDF ebook]
From Microstructures to Reliability

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Copertina di Tae-Kyu Lee & Thomas R. Bieler: Fundamentals of Lead-Free Solder Interconnect Technology (PDF)

This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.

€96.29

Tabella dei contenuti

Introduction.- Interconnection : The Joint.- Phase Equilibria and Microstructure of Sn-Ag-Cu Alloys.- Microstructure Development; Solidification and Isothermal Aging.- Thermal Cycling Performance.- Mechanical Stability and Performance.- Chemical and Environment Attack.- Challenges in Future Generation Interconnects: Microstructure Again.

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Lingua Inglese ● Formato PDF ● Pagine 253 ● ISBN 9781461492665 ● Dimensione 16.1 MB ● Casa editrice Springer US ● Città NY ● Paese US ● Pubblicato 2014 ● Scaricabile 24 mesi ● Moneta EUR ● ID 3534153 ● Protezione dalla copia DRM sociale

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