E-kitap > Bilim > Mühendislik / Teknik > Elektronik, Elektrik Mühendisliği > Tae-Kyu Lee & Thomas R. Bieler: Fundamentals of Lead-Free Solder Interconnect Technology (PDF)

Tae-Kyu Lee & Thomas R. Bieler
Fundamentals of Lead-Free Solder Interconnect Technology [PDF ebook]
From Microstructures to Reliability

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Örtmek Tae-Kyu Lee & Thomas R. Bieler: Fundamentals of Lead-Free Solder Interconnect Technology (PDF)

This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.

€96.29

İçerik tablosu

Introduction.- Interconnection : The Joint.- Phase Equilibria and Microstructure of Sn-Ag-Cu Alloys.- Microstructure Development; Solidification and Isothermal Aging.- Thermal Cycling Performance.- Mechanical Stability and Performance.- Chemical and Environment Attack.- Challenges in Future Generation Interconnects: Microstructure Again.

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Dil İngilizce ● Biçim PDF ● Sayfalar 253 ● ISBN 9781461492665 ● Dosya boyutu 16.1 MB ● Yayımcı Springer US ● Kent NY ● Ülke US ● Yayınlanan 2014 ● İndirilebilir 24 aylar ● Döviz EUR ● Kimlik 3534153 ● Kopya koruma Sosyal DRM

Aynı yazardan daha fazla e-kitap / Editör

Tae-Kyu Lee Thomas R. Bieler Choong-Un Kim Hongtao Ma

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