Електронна книга > Наука > Техника > Электроника, Электротехника, Телекоммуникации > Tae-Kyu Lee & Thomas R. Bieler: Fundamentals of Lead-Free Solder Interconnect Technology (PDF)

Tae-Kyu Lee & Thomas R. Bieler
Fundamentals of Lead-Free Solder Interconnect Technology [PDF ebook]
From Microstructures to Reliability

поддержка

Обложка Tae-Kyu Lee & Thomas R. Bieler: Fundamentals of Lead-Free Solder Interconnect Technology (PDF)

This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.

€96.29

Содержание

Introduction.- Interconnection : The Joint.- Phase Equilibria and Microstructure of Sn-Ag-Cu Alloys.- Microstructure Development; Solidification and Isothermal Aging.- Thermal Cycling Performance.- Mechanical Stability and Performance.- Chemical and Environment Attack.- Challenges in Future Generation Interconnects: Microstructure Again.

Купите эту электронную книгу и получите еще одну БЕСПЛАТНО!

язык английский ● Формат PDF ● страницы 253 ● ISBN 9781461492665 ● Размер файла 16.1 MB ● издатель Springer US ● город NY ● Страна US ● опубликованный 2014 ● Загружаемые 24 месяцы ● валюта EUR ● Код товара 3534153 ● Защита от копирования Социальный DRM

Больше книг от того же автора (ов) / редактор

Tae-Kyu Lee Thomas R. Bieler Choong-Un Kim Hongtao Ma

18 868 Электронные книги в этой категории

Обложка Denise Brehaut: GMDSS

Denise Brehaut: GMDSS

The Global Maritime Distress and Safety System (GMDSS) — the maritime equivalent to the emergency services number — provides a fast and efficient way of calling for assistance at sea, whatever the si …

Обложка S.B. Furber: VLSI Risc Architecture and Organization

S.B. Furber: VLSI Risc Architecture and Organization

With the expectation that architectural improvements will play a significant role inadvancing processor performance, it is critical for readers to maintain an up-to-date, unified overview of technolo …

Обложка Evgeni Perelroyzen: Digital Integrated Circuits

Evgeni Perelroyzen: Digital Integrated Circuits

A current trend in digital design-the integration of the MATLAB® components Simulink® and Stateflow® for model building, simulations, system testing, and fault detection-allows for better control ove …

Обложка Alma Y. (University of Guadalajara, Guadalajara, Mexico) Alanis & Nancy (University of Guadalajara, Guadalajara, Mexico) Arana-Daniel: Neural Networks for Robotics

Alma Y. (University of Guadalajara, Guadalajara, Mexico) Alanis & Nancy (University of Guadalajara, Guadalajara, Mexico) Arana-Daniel: Neural Networks for Robotics

The book offers an insight on artificial neural networks for giving a robot a high level of autonomous tasks, such as navigation, cost mapping, object recognition, intelligent control of ground and a …

Обложка Thomas Sikina: Introduction to Active Phased Arrays

Thomas Sikina: Introduction to Active Phased Arrays

Written by a renowned expert in the field, this book presents the fundamentals of phased array systems, including contemporary and advanced methods. It features applications ranging from advanced and …

Обложка J Ronayne: Integrated Services Digital Network

J Ronayne: Integrated Services Digital Network

An introduction to ‘ISDN’ which brings the technology up-to-date, incorporating developments in ‘ATM’, ‘SDH’ and Broadband ‘ISDN’. This book is suitable for self-learning communications professionals …

Обложка Spyros G. Tzafestas: Intelligent Robotic Systems

Spyros G. Tzafestas: Intelligent Robotic Systems

A multiplicity of techniques and angles of attack are incorporated in 18 contributions describing recent developments in the structure, architecture, programming, control, and implementation of indus …

Обложка Nancy (Sinhgad Institutes SPPU, Pune, India.) Ambritta P. & Arvind Vinayak (Sinhgad Institutes SPPU, Pune, India.) Deshpande: The Convergence of Internet of Things and Cloud for Smart Computing

Nancy (Sinhgad Institutes SPPU, Pune, India.) Ambritta P. & Arvind Vinayak (Sinhgad Institutes SPPU, Pune, India.) Deshpande: The Convergence of Internet of Things and Cloud for Smart Computing

This book presents the know-how of the real-time Io T application development activity including a basic understanding of the Io T architecture, use cases, smart computing, and the associated challen …

Обложка Gian Marco Iodice: TinyML Cookbook

Gian Marco Iodice: TinyML Cookbook

<p><b>Over 70 recipes to help you develop smart applications on Arduino Nano 33 BLE Sense, Raspberry Pi Pico, and Spark Fun Red Board Artemis Nano using the power of machine learning Purc …

Обложка Kiran (Department of Information Technology, National Institute of Technology Karnataka (NITK), Surathkal, Mangalore, Karnataka, India) M & G Ram Mohana (National Institute of Technology Karnataka Surathkal, Mangalore, India) Reddy: Mobile Ad Hoc Networks

Kiran (Department of Information Technology, National Institute of Technology Karnataka (NITK), Surathkal, Mangalore, Karnataka, India) M & G Ram Mohana (National Institute of Technology Karnataka Surathkal, Mangalore, India) Reddy: Mobile Ad Hoc Networks

In recent years, a lot of work has been done in an effort to incorporate Swarm Intelligence (SI) techniques in building an adaptive routing protocol for Mobile Ad Hoc Networks (MANETs). Since central …

Следущая страница >>>