Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th
Dieses Ebook kaufen – und ein weitere GRATIS erhalten!
Sprache Englisch ● Format EPUB ● Seiten 350 ● ISBN 9781040000106 ● Herausgeber Kuan-Neng Chen & Steven J. Koester ● Verlag Jenny Stanford Publishing ● Erscheinungsjahr 2016 ● herunterladbar 3 mal ● Währung EUR ● ID 9202712 ● Kopierschutz Adobe DRM
erfordert DRM-fähige Lesetechnologie