Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th
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Language English ● Format EPUB ● Pages 350 ● ISBN 9781040000106 ● Editor Kuan-Neng Chen & Steven J. Koester ● Publisher Jenny Stanford Publishing ● Published 2016 ● Downloadable 3 times ● Currency EUR ● ID 9202712 ● Copy protection Adobe DRM
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