Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th
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Bahasa Inggeris ● Format EPUB ● Halaman-halaman 350 ● ISBN 9781040000106 ● Penyunting Kuan-Neng Chen & Steven J. Koester ● Penerbit Jenny Stanford Publishing ● Diterbitkan 2016 ● Muat turun 3 kali ● Mata wang EUR ● ID 9202712 ● Salin perlindungan Adobe DRM
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