Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th
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语言 英语 ● 格式 EPUB ● 网页 350 ● ISBN 9781040000106 ● 编辑 Kuan-Neng Chen & Steven J. Koester ● 出版者 Jenny Stanford Publishing ● 发布时间 2016 ● 下载 3 时 ● 货币 EUR ● ID 9202712 ● 复制保护 Adobe DRM
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