Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th
Dieses Ebook kaufen – und ein weitere GRATIS erhalten!
Format PDF ● Seiten 350 ● ISBN 9789814303828 ● Herausgeber Kuan-Neng Chen & Steven J. Koester ● Verlag Pan Stanford Publishing ● Erscheinungsjahr 2016 ● herunterladbar 6 mal ● Währung EUR ● ID 2448188 ● Kopierschutz Adobe DRM
erfordert DRM-fähige Lesetechnologie