Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th
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Format PDF ● Pagini 350 ● ISBN 9789814303828 ● Editor Kuan-Neng Chen & Steven J. Koester ● Editura Pan Stanford Publishing ● Publicat 2016 ● Descărcabil 6 ori ● Valută EUR ● ID 2448188 ● Protecție împotriva copiilor Adobe DRM
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