Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th
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Biçim PDF ● Sayfalar 350 ● ISBN 9789814303828 ● Editör Kuan-Neng Chen & Steven J. Koester ● Yayımcı Pan Stanford Publishing ● Yayınlanan 2016 ● İndirilebilir 6 kez ● Döviz EUR ● Kimlik 2448188 ● Kopya koruma Adobe DRM
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