Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th
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Format PDF ● Pages 350 ● ISBN 9789814303828 ● Éditeur Kuan-Neng Chen & Steven J. Koester ● Maison d’édition Pan Stanford Publishing ● Publié 2016 ● Téléchargeable 6 fois ● Devise EUR ● ID 2448188 ● Protection contre la copie Adobe DRM
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