Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th
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Formato PDF ● Pagine 350 ● ISBN 9789814303828 ● Editore Kuan-Neng Chen & Steven J. Koester ● Casa editrice Pan Stanford Publishing ● Pubblicato 2016 ● Scaricabile 6 volte ● Moneta EUR ● ID 2448188 ● Protezione dalla copia Adobe DRM
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