Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th
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Formaat PDF ● Pagina’s 350 ● ISBN 9789814303828 ● Editor Kuan-Neng Chen & Steven J. Koester ● Uitgeverij Pan Stanford Publishing ● Gepubliceerd 2016 ● Downloadbare 6 keer ● Valuta EUR ● ID 2448188 ● Kopieerbeveiliging Adobe DRM
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