Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th
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Format PDF ● Strony 350 ● ISBN 9789814303828 ● Redaktor Kuan-Neng Chen & Steven J. Koester ● Wydawca Pan Stanford Publishing ● Opublikowany 2016 ● Do pobrania 6 czasy ● Waluta EUR ● ID 2448188 ● Ochrona przed kopiowaniem Adobe DRM
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